Tengu Electronics - Dissolution Sequencer

Ship Modifications

Subsystems

This subsystems employs a nano-electromechanical dispersion field to strengthen a vessel's sensor systems. Made from billions of advanced molecular-level circuits, the subsystem offers improved protection against hostile ECM.

Subsystem Skill Bonus: 15% bonus to ship sensor strength, 5% bonus to targeting range per level.

Public: yes
Mass: 1,200,000 kg
Volume: 40 m3
Meta Level: 1
Tech Level: 3

Fitting

CPU Output: 475 tf
Subsystem Slot: 125
Hi Slot Modifier: 0
Med Slot Modifier: +3
Low Slot Modifier: +1
Restricted To Ship Type: Tengu

Structure

Structure Hitpoints: 40 HP

Targeting

Maximum Targeting Range: 75 km
RADAR Sensor Strength: 0 points
LADAR Sensor Strength: 0 points
Magnetometric Sensor Strength: 0 points
Gravimetric Sensor Strength: 20 points
Scan Resolution: 235 mm

Miscellaneous

Determines Color: 2
Subsystem Bonus Caldari Electronic: 15
Subsystem Bonus Caldari Electronic 2: 5

Blueprint

Subsystem Blueprints

Public: yes
Volume: 0.01 m3
Tech Level: 3

Wastage Factor: 0%
Max Runs Per Blueprint Copy: 1,000
Manufacturing Time: 20 min
Research Material Time: 6 hr, 40 min
Research Copy Time: 6 days, 22 hr, 40 min
Research Productivity Time: 6 hr, 40 min
Research Invention Time: 1 day, 1 hr
Productivity Modifier: 1,200
Material Modifier: 5